Methods and apparatus for providing fluid to a semiconductor device processing apparatus

ABSTRACT

In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.

The present application is a continuation of U.S. patent applicationSer. No. 11/048,106, filed Jan. 28, 2005, which claims priority fromU.S. Provisional Patent Application Ser. No. 60/540,540, filed Jan. 30,2004. Both of these patent applications are incorporated by referenceherein in their entirety.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor devicemanufacturing, and more particularly to methods and apparatus forproviding fluid to a semiconductor device processing apparatus.

BACKGROUND OF THE INVENTION

While manufacturing a semiconductor device, a substrate may be processedby a semiconductor device processing apparatus, such as a polishingdevice. A polishing device may dispense a fluid, such as a chemical(e.g., a slurry) or water (e.g., deionized (DI) water), to the substratebeing processed. To supply chemicals and/or DI water to a polishingdevice, a plurality of valves that form a valve system may be employed.Generally, a plurality of separate valves are coupled together to formthe valve system. The use of separate valves, however, is costly andnon-compact. Such a valve system typically cannot be included in apolishing device. Accordingly, improved methods and apparatus aredesired for providing fluid to a semiconductor device processingapparatus.

SUMMARY OF THE INVENTION

In a first aspect of the invention, a valve assembly is provided. Thevalve assembly is adapted to provide fluid to a semiconductor deviceprocessing apparatus and includes a valve assembly output adapted tooutput at least one of DI water and a chemical. A first valve of thevalve assembly includes (1) a first input adapted to receive thechemical; (2) a first output adapted to circulate the chemical to achemical return; and (3) a second output adapted to output the chemicalto the valve assembly output. The valve assembly also includes a secondvalve positioned downstream from the first valve. The second valveincludes (1) an input adapted to receive deionized (DI) water; and (2)an output adapted to output DI water to the valve assembly output. Acheck valve is coupled between the second output of the first valve andthe output of the second valve. The first valve, second valve and checkvalve are included in a single manifold.

In a second aspect of the invention, a fluid dispensing system isprovided. The fluid dispensing system is adapted to provide fluid to asemiconductor device processing apparatus and includes a plurality ofthe above described valve assemblies within a single manifold.

In a third aspect of the invention, a semiconductor device processingapparatus is provided that includes a polishing device and a valveassembly coupled to the polishing device. The valve assembly is adaptedto provide fluid to the polishing device and includes a valve assemblyoutput adapted to output at least one of DI water and a chemical to thepolishing device. A first valve of the valve assembly includes (1) afirst input adapted to receive the chemical; (2) a first output adaptedto circulate the chemical to a chemical return; and (3) a second outputadapted to output the chemical to the valve assembly output. The valveassembly also includes a second valve positioned downstream from thefirst valve. The second valve includes (1) an input adapted to receivedeionized (DI) water; and (2) an output adapted to output DI water tothe valve assembly output. A check valve is coupled between the secondoutput of the first valve and the output of the second valve. The firstvalve, second valve and check valve are included in a single manifold.Numerous other aspects are provided, as are methods in accordance withthese other aspects of the invention.

Other features and aspects of the present invention will become morefully apparent from the following detailed description, the appendedclaims and the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates an exemplary fluid dispensing system in accordancewith an embodiment of the present invention.

FIG. 2 is a cross-sectional schematic representation of a valve assemblyincluded in the fluid dispensing system in accordance with an embodimentof the present invention.

FIG. 3 is a schematic representation of a second exemplary fluiddispensing system in accordance with an embodiment of the presentinvention.

FIG. 4 is a block diagram of a third exemplary fluid dispensing system,which is an alternative embodiment of the second exemplary fluiddispensing system.

DETAILED DESCRIPTION

The present invention relates to reducing the space occupied by (e.g.,footprint) and cost of a fluid dispensing system for providing ordispensing fluid to a semiconductor device processing apparatus.Further, the volume of dead legs included in the fluid dispensing systemis greatly reduced when compared to conventional fluid dispensingsystems.

FIG. 1 illustrates an exemplary fluid dispensing system in accordancewith an embodiment of the present invention. With reference to FIG. 1,the fluid dispensing system 101 is coupled to a chemical source 103,such as a slurry supply. The fluid dispensing system 101 receives achemical (e.g., slurry) output from the chemical source 103. Similarly,the fluid dispensing system 101 is coupled to a supply of water (e.g.,deionized (DI) water) 105 and receives DI water output from the supplyof water 105. The fluid dispensing system 101 also is coupled to achemical return 107 and a DI water return 109. When the fluid dispensingsystem 101 is not using the chemical received from the chemical source103 and/or the DI water received from the supply of DI water 105, thefluid dispensing system 101 may circulate the chemical and/or the DIwater by outputting the chemical and/or DI water to the chemical return107 and/or the DI water return 109, respectively.

In one embodiment, the fluid dispensing system 101 is coupled to andincluded in a semiconductor device processing apparatus 111, such as apolishing device for performing chemical mechanical polishing. In otherembodiments, the fluid dispensing system 101 may be external to thesemiconductor device processing apparatus 111. Assuming that thesemiconductor device processing apparatus 111 is a polishing device, thesemiconductor polishing device 111 may include and/or be coupled to ascrubbing device 113 for removing polishing chemicals and particulatesfrom the surface of a substrate being processed by the polishing device111. An output of the fluid dispensing system 101 is coupled to thescrubber device 113 and provides the chemical and/or DI water to thescrubber device 113 during substrate processing.

FIG. 2 is a cross-sectional schematic representation of a valve assembly201 included in the fluid dispensing system 101 in accordance with anembodiment of the present invention. The valve assembly 201 is adaptedto receive fluid and output (e.g., provide) fluid to the semiconductordevice processing apparatus 111. With reference to FIG. 2, the valveassembly 201 includes a first valve 203 coupled to a second valve 205.The first valve 203 is adapted to (1) receive a chemical from thechemical source or supply 103 and circulate the chemical to the chemicalreturn 107; or (2) output the chemical to the semiconductor deviceprocessing apparatus 111. More specifically, the first valve 203includes a first input 207 adapted to couple to the chemical source 103and receive the chemical from the chemical source 103. The first valve203 includes a first output 209 (e.g., a chemical-return output) adaptedto couple to the chemical return 107 and circulate the chemical byoutputting the chemical to the chemical return 107. The size (e.g.,diameter) of the first output 209 may be smaller than the size of thefirst input 207 to provide increased back pressure. Further, the firstvalve 203 includes a second output 211 adapted to output the chemicaltoward an output 213 of the valve assembly 201. Therefore, in theembodiment shown, the first valve 203 is a three-way valve with oneinput and two outputs. Valves of different configurations and/or typesmay be employed as the first valve 203.

The first valve 203 includes a manual override switch 215 (e.g., a tap)adapted to prevent the first valve 203 from outputting the chemical fromthe second output 211. Therefore, actuating (e.g., turning on) themanual override switch 215 may prevent (e.g., lock out) one or morecomponents of the semiconductor device processing apparatus 111 to whichthe valve assembly 201 is coupled from receiving the chemical until themanual override switch 215 is turned off. In one embodiment, the defaultsetting of the manual override switch 215 is on, which prevents one ormore components of the semiconductor device processing apparatus 111from receiving the chemical. In other embodiments, the default settingof the manual override switch 215 may be off. It should be noted thatthe first valve 203 of the valve assembly 201 incorporates thefunctionality of two valves (e.g., a manual valve and three-way valve)into a single valve, thereby minimizing the space required by the valveassembly 201.

The valve assembly 201 includes a second valve 205 coupled to the firstvalve 203 via a check valve 217. The check valve 217 is adapted topermit a one-way flow of fluid in the valve assembly 201 (as describedbelow). The second valve 205 is positioned downstream from the firstvalve 203. More specifically, the second output 211 of the first valve203 is coupled to an output 219 of the second valve 205 via the checkvalve 217.

The second valve 205 is adapted to receive and output DI water. Morespecifically, the second valve 205 includes an input 221 adapted tocouple to the DI water supply 105 and receive DI water from the DI watersupply 105 of the fluid dispensing system 101. The output 219 of thesecond valve 205 is coupled to the output 213 of the valve assembly 201and adapted to output DI water thereto. In one embodiment, the secondvalve 205 is a two-way valve. However, different configurations and/ortypes of valves may be employed as the second valve 205.

As shown in FIG. 2, the output 213 of the valve assembly 201 is coupledto the first valve 203 (e.g., via the second output 211 of the firstvalve 203) and to the second valve 205 (e.g., via the output 219 of thesecond valve 205). The output 213 of the valve assembly 201 is adaptedto output (e.g., dispense) the chemical, which is received from thefirst valve 203, and/or DI water, which is received from the secondvalve 205, from the valve assembly 201 to the semiconductor deviceprocessing apparatus 111.

The valve assembly 201 may include a DI water return output (not shownin FIG. 2, but see reference numeral 301 in FIG. 3) coupled to thesecond valve 205 and adapted to couple to the DI return 109 andcirculate DI water by outputting the DI water to the DI return 109.Before being output from the DI-water-return output, the DI waterreceived in the valve assembly 201 travels along a DI water circulationpath 223.

In one embodiment, one or more of the first and second valves 203, 205are pneumatically-actuated valves. However, other types of valves may beemployed.

As shown in FIG. 2, the first valve 203, second valve 205 and checkvalve 217 are included in or formed as a single manifold (e.g., valvemanifold 225). In this manner, the space occupied by the valve assembly201, and therefore, the fluid dispensing system 101, is reduced comparedto conventional fluid dispensing systems. Further, including the firstvalve 203, second valve 205 and check valve 217 in the valve manifold225 reduces the number of fittings (e.g., flare or other suitablefittings) required to receive the chemical in and/or dispense thechemical from the fluid dispensing system 101. The number of potentialleakage points thereby is reduced.

The operation of the valve assembly 201 (and the fluid dispensing system101) is now described with reference to FIG. 2. During operation, thevalve assembly 201 receives a chemical. More specifically, the firstinput 207 of the first valve 203 receives the chemical from the chemicalsupply 103. When the first valve 203 is closed (e.g., via the manualoverride switch 215 or pneumatically), the first valve 203 outputs thechemical from the first output 209 (e.g., a chemical return output) ofthe first valve 203. In this manner, the chemical is circulated from thechemical supply 103 to the chemical return 107. The circulation of thechemical prevents conglomeration and/or settling of the chemical withinthe first valve 103 (so as to reduce wafer defects which may be causedby such conglomeration/settling).

While the first valve 203 is closed, the second output 211 of the firstvalve 203 does not output the chemical. Note that the volume between thesecond output 211 of the first valve 203 and the check valve 217 mayinclude stagnant chemicals output by the first valve 203 before thefirst valve 203 was closed. That is, the volume between the secondoutput 211 of the first valve 203 and the check valve 217 may be a deadleg. However, because the dead leg is located within the manifold 225,its volume is relatively small.

Alternatively, when the first valve 203 is open, the first valve 203 mayoutput the chemical from the second output 211 of the first valve 203toward the check valve 217. The check valve 217 permits a one-way flowof fluid from the first valve 203 through the check valve 217 and towardthe output 213 of the valve assembly 201. (It is assumed the secondvalve 205 is closed. As described below, the second valve 205 may beclosed while the first valve 203 is open to avoid contaminating the DIwater supply with the chemical.) Thereafter, the valve assembly 201dispenses the chemical from the output 213 (e.g., valve manifold output)of the valve assembly 201. For example, the valve assembly 201 and,therefore, the fluid dispensing system 101 may dispense the chemical toa polishing device component, such as the scrubber device 113.

Further, during operation, the valve assembly 201 receives DI water.More specifically, the input 221 of the second valve 205 receives DIwater from the DI water supply 105, for example, via a DI water input220 (FIG. 3) of the fluid dispensing system 101. When the second valve205 is closed (e.g., pneumatically), the DI water received by the valveassembly 201 circulates along the DI-water circulation path 223 towardthe DI-water-return output (not shown in FIG. 2; 301 in FIG. 3).Alternatively, when the second valve 205 is open, the second valve 205outputs the DI water from the output 219 of the second valve 205 towardthe check valve 217 and/or the output 213 of the valve assembly 201.Because the check valve 217 permits only a one-way flow of fluid, andthe second valve 205 is positioned downstream from the check valve 217,the check valve 217 prevents the DI water from the output 219 of thesecond valve 205 from reaching the first valve 203. DI water thereby isprevented from contaminating the chemical supply 103 or the chemicalreturn 107.

The DI water output from the output 219 of the second valve 205 travelstoward the output 213 of the valve assembly 201 along an output path 227of the valve assembly 201. The DI water may serve to purge portions ofthe valve assembly 201 (e.g., the path 227). Thereafter, the valveassembly 201 dispenses the DI water from the output 213 (e.g., valvemanifold output) of the valve assembly 201. For example, the valveassembly 201 and, therefore, the fluid dispensing system 101 maydispense the DI water to a scrubber device 113 of a polishing device.Because DI water may flow along the DI water circulation path 223 andthrough the DI water return output (not shown in FIG. 2; 301 in FIG. 3)while the second valve 205 is closed, and along output path 227 andthrough the output 213 of the valve assembly 201 when the second valve205 is open, no DI water dead legs exist.

In one embodiment, the second valve 205 is closed while the first valve203 is open. In this manner, the chemical output by the second output211 of the first valve 203 toward the output 213 of the valve assembly201 may be prevented from contaminating the DI water supply 105 and/orthe DI water return 109. Further, the DI water may be prevented fromdiluting the chemical. The valve assembly 201 dispenses the chemicalfrom the output 213 of the valve assembly 201 to a component of thesemiconductor device processing apparatus 111.

The second valve 205 may be open while the first valve 203 is closed. Inthis manner, the valve assembly 201 dispenses DI water from the output213 of the valve assembly 201 to a component of the semiconductor deviceprocessing apparatus 111, and circulates the chemical from the firstoutput 209 of the first valve 203 to the chemical return 107.

Alternatively, the first 203 and second valves 205 both may be closed.In this manner, the valve assembly 201 circulates the chemical and DIwater to the chemical return 107 and the DI water return 109,respectively. Other combinations of states (e.g., on or off) may beemployed for the first valve 203 and second valve 205. Altering thestates of the first valve 203 and/or second valve 205 enables a user toemploy the valve assembly 201 to selectively supply the chemical to oneor more components of a semiconductor device processing apparatus 111.The states of the first valve 203 and/or second valve 205 may be alteredusing two actuators (e.g., an actuator corresponding to each of thefirst valve 203 and second valve 205). Other numbers of actuators may beused.

FIG. 3 is a schematic representation of a second exemplary fluiddispensing system 303 in accordance with an embodiment of the presentinvention. The second exemplary fluid dispensing system 303 includes aplurality of the valve assemblies 201 a-h of FIG. 2 coupled together.Each of the plurality of valve assemblies 201 a-h are included or formedin the same manifold 225. Therefore, the space occupied by the secondexemplary fluid dispensing system 303 is smaller than that occupied byconventional fluid dispensing systems. Each of the plurality of valveassemblies 201 a-h may be (1) coupled to a chemical supply 103 via arespective first input 207 a-h (only 207 h is shown in FIG. 3); (2)coupled to a chemical return 107 via a respective first output 209 a-h;and (3) coupled to a respective component of a semiconductor deviceprocessing apparatus 111 via a respective output 213 a-h of the valveassembly 201 a-h. Two or more of the plurality of valve assemblies 201a-h may be coupled to the same or different chemical supplies, chemicalreturns and/or semiconductor device processing apparatus components.Although in one embodiment, the second exemplary fluid dispensing system303 includes eight valve assemblies 201 a-h, the second exemplary fluiddispensing system 303 may include a larger or smaller number of valveassemblies 201.

The second exemplary fluid dispensing system 303 includes a DI waterinput 220 adapted to couple to and receive DI water from the DI supply105 and a DI-water-return output 301 adapted to couple to and circulateDI water to the DI water return 109. For example, the input of thesecond valve 205 a of the valve assembly 201 a adjacent a first end ofthe manifold 225 may serve as or be coupled to the DI water input 220 ofthe second exemplary fluid dispensing system 303. The inputs of thesecond valves of the remaining valve assemblies 201 b-h may be similarlycoupled to the DI-water input 220. Similar to the DI water circulationpath 223 of the valve assembly 201 of FIG. 2, the second exemplary fluiddispensing system 303 may include a DI water circulation path, forexample, through one or more (e.g., each of) the second valves 205 a-hof the plurality of valve assemblies 201 a-h. The operation of thesecond exemplary fluid dispensing system 303 is similar to that of thefirst exemplary fluid dispensing system 101 of FIG. 2 and is notdescribed herein.

By providing and employing the second exemplary fluid dispensing system303, one or more chemicals and/or DI water may be selectively dispensed(e.g., supplied) to one or more components of the semiconductor deviceprocessing apparatus 111. The one or more chemicals and/or DI water alsomay be circulated to respective chemical returns and/or a DI waterreturn. The footprint, cost, and size and number of dead legs in fluidcirculation paths of the second exemplary fluid dispensing system 303thereby are reduced.

FIG. 4 is a block diagram of a third exemplary fluid dispensing system401, which is an alternative embodiment of the second exemplary fluiddispensing system 303, in accordance with an embodiment of theinvention. Like reference numerals have been used to designatefunctionally similar components. The third exemplary fluid dispensingsystem 401 includes three valve assemblies 201 a-c similar to the valveassemblies 201 a-h of the second exemplary fluid dispensing system 303.Other numbers of valve assemblies may be employed. In contrast to thesecond exemplary fluid dispensing system 303, the third exemplary fluiddispensing system 401 includes a DI-water input 402 (e.g., in themanifold 225), which is coupled to the input 221 a-c of a second valve205 a-c included in each of the valve assemblies 201 a-c via a checkvalve 403 adapted to permit one-way flow of fluid. As shown in FIG. 4,the DI water path 223 is coupled to and extends through the inputs 221a-c of the second valves 205 a-c of each of the valve assemblies 201a-c.

Further, the outputs 213 a-c of the valve assemblies 201 a-c are eachcoupled to a pressure transducer 405 a-c for measuring incoming pressure(e.g., the pressure of a chemical or DI water output from the thirdexemplary fluid dispensing system 401). Each output 213 a-c of the valveassemblies 201 a-c also is coupled to a slurry or chemical dispensemodule 407 a-c.

The foregoing description discloses only exemplary embodiments of theinvention. Modifications of the above disclosed apparatus and methodswhich fall within the scope of the invention will be readily apparent tothose of ordinary skill in the art. For example, one or more of thepneumatically-actuated valves of the present fluid dispensing systems101, 303, 401 may be remotely actuated, (e.g., by software). The fluiddispensing system 101, 303, 401 may be fabricated from chemicallyresistant materials such as PTFE (e.g., Teflon®), PFA, or other highpurity polymers. Other valve materials also may be employed. In oneembodiment, a plurality of second exemplary fluid dispensing systems 303may be coupled together (e.g., connected in a row). A removable DI watersupply fitting may be coupled to the DI water input 220 of the firstfluid dispensing system 303 in the row. Similarly, a removable DI waterreturn fitting may be coupled to the DI-water-return output 301 of thelast fluid dispensing system 303 of the row.

In one or more embodiments, the first input 207 and the first output 209of the first valve 203 are included on the same side of the manifold225, thereby facilitating connections to the chemical supply 103 andchemical return 107. Further, the first valve 203 of each of the valveassemblies 201 of the fluid dispensing system 101, which includes themanual override switch 215, may be positioned at the bulkhead of thefluid dispensing system 101, thereby reducing the need for additionalmanual valves. The first valves 203 may be positioned differently.

Accordingly, while the present invention has been disclosed inconnection with exemplary embodiments thereof, it should be understoodthat other embodiments may fall within the spirit and scope of theinvention, as defined by the following claims.

1. A method of dispensing a fluid, comprising: providing a valveassembly that includes a first valve, a second valve and a check valvein a single manifold; receiving a chemical in the valve assembly from achemical supply; receiving deionized (DI) water in the valve assemblyfrom a DI water supply; when the first valve of the valve assembly isclosed and the second valve of the valve assembly is open, at least oneof outputting the chemical from a chemical-return output of the valveassembly and outputting DI water from a valve assembly output; when thefirst valve of the valve assembly is open and the second valve of thevalve assembly is closed, at least one of outputting the chemical fromthe valve assembly output and outputting the DI water from aDI-water-return output of the valve assembly; and when the first valveis closed and the second valve is open, preventing DI water in the valveassembly from contaminating the chemical.
 2. The method of claim 1further comprising reducing a volume of dead legs in the valve assembly.3. The method of claim 1 further comprising reducing a number offittings required to at least one of receive the chemical in the valveassembly and dispense the chemical from the valve assembly.
 4. Themethod of claim 3 further comprising reducing a number of leakage pointsin the valve assembly.
 5. The method of claim 1 further comprisingreducing a number of dead legs in the valve assembly.
 6. The method ofclaim 1 further comprising actuating a manual override switch of thefirst valve to prevent the chemical from being output from the valveassembly output.
 7. A method of dispensing a fluid, comprising:providing a valve assembly that includes a first valve, a second valveand a check valve in a single manifold; receiving a chemical in thevalve assembly from a chemical supply; receiving deionized (DI) water inthe valve assembly from a DI water supply; employing the first valve ofthe valve assembly in a closed position so as to circulate the chemicalthrough a first output of the first valve to a chemical return; andemploying the second valve of the valve assembly in an open position soas to dispense DI water from a valve assembly output.
 8. The method ofclaim 7 further comprising: employing the first valve of the valveassembly in an open position so as to dispense the chemical from thevalve assembly output; and employing the second valve of the valveassembly in a closed position so as to circulate DI water through adeionized-water-return output of the valve assembly.
 9. The method ofclaim 7 further comprising reducing a volume of dead legs in the valveassembly.
 10. The method of claim 7 further comprising reducing a numberof fittings required to at least one of receive the chemical in thevalve assembly and dispense the chemical from the valve assembly. 11.The method of claim 10 further comprising reducing a number of leakagepoints in the valve assembly.
 12. The method of claim 7 furthercomprising reducing a number of dead legs in the valve assembly.
 13. Amethod of dispensing a fluid, comprising: providing a valve assemblyadapted to provide fluid to a semiconductor device processing apparatus,the valve assembly including: a valve assembly output adapted to outputat least one of DI water and a chemical; a first valve comprising: afirst input adapted to receive the chemical; a first output adapted tocirculate the chemical to a chemical return; and a second output adaptedto output the chemical to the valve assembly output; a second valvepositioned downstream from the first valve comprising: an input adaptedto receive deionized (DI) water; and an output adapted to output DIwater to the valve assembly output; and a check valve coupled betweenthe second output of the first valve and the output of the second valve;wherein the first valve, second valve and check valve are included in asingle manifold; and employing the valve assembly to selectively supplythe chemical to the semiconductor device processing apparatus.
 14. Themethod of claim 13 further comprising reducing a volume of dead legs inthe valve assembly.
 15. The method of claim 13 further comprisingreducing a number of fittings required to at least one of receive thechemical in the valve assembly and dispense the chemical from the valveassembly.
 16. The method of claim 15 further comprising reducing anumber of leakage points in the valve assembly.
 17. The method of claim13 further comprising reducing a number of dead legs in the valveassembly.